Developments In Surface Contamination And Cleaning

As semiconductor and electronic device sizes shrink to the nanoscale, contamination from ever smaller particles become critical to high yield and high performance. This contamination can take the form of dust, tiny particles of abrasive material left behind by polishing processes, airborne pollution [...]
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As semiconductor and electronic device sizes shrink to the nanoscale, contamination from ever smaller particles become critical to high yield and high performance. This contamination can take the form of dust, tiny particles of abrasive material left behind by polishing processes, airborne pollution or imperfect cleaning procedures. In this second volume in the Developments in Surface Contamination and Cleaning series editors Rajiv Kohli and Kash Mittal have brought together the work of experts from different industry sectors and backgrounds to provide a state-of-the-art survey and practical best-practice guidance for scientists and engineers engaged in surface cleaning, or handling the consequences of surface contamination. Topics covered in volume two include: A systems analysis approach to contamination control. A review of the literature on the important physical factors that influence the behavior of particle deposition in enclosures. An overview of current yield models. An overview of the types of strippable coatings and their properties and discusses some of the applications of these coatings for removal of surface contaminants. An in-depth look at Ultrasonic Cleaning.